A new de-embedding technique for on-board structures applied to the bandwith measurement of packagesVAN HAUWERMEIREN, L; BOTTE, M; DE ZUTTER, D et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 3, pp 300-303, issn 0148-6411Article

Au-In bonding below the eutectic temperatureLEE, C. C; WANG, C. Y; MATIJASEVIC, G et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 3, pp 311-316, issn 0148-6411Article

Automated vision system for inspection of IC pads and bondsSREENIVASAN, K. K; SRINATH, M; KHOTANZAD, A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 3, pp 333-338, issn 0148-6411Article

Corrosion of thin film aluminum metallization: conformal coating materialsOSENBACH, J. S; ZELL, J. L.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 3, pp 350-359, issn 0148-6411Article

High frequency design and performance of tubular capacitorsMURPHY, A. T; YOUNG, F. J.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 2, pp 228-237, issn 0148-6411Article

Mode mixing and polarization scrambling microparticles in polymeric resin filled optical couplers : PackagingGRIMES, G. J; BLYLER, L. L.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 3, pp 266-271, issn 0148-6411Article

Tape automated bonding inner lead bonded devices (TAB/ILB) failure analysisCHIH-HANG TUNG; YEN-SHU KUO; SHIH-MING CHANG et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 3, pp 304-310, issn 0148-6411Article

Fabrication of an insulated metal substrate (IMS), having an insulating layer with a high dielectric constant : PackagingASAI, S; FUNAKI, M; SAWA, H et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 5, pp 499-504, issn 0148-6411Article

Processing and microwave characterization of multilevel interconnects using benzocyclobutene dielectricCHINOY, P. B; TAJADOD, J.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 7, pp 714-719, issn 0148-6411Article

Reliability of passivated copper multichip module structures embedded in polyimideCECH, J. M; BURNETT, A. F; CHUNG-PING CHIEN et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 7, pp 752-758, issn 0148-6411Article

Resistance adjustment with short-pulse Nd:YAG laser for RuO₂-based thick-film resistors buried in polyimide filmGOFUKU, E; OHNAWA, T; KOHARA, M et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 6, pp 592-597, issn 0148-6411Article

Thermal analysis of electrode heating and melting due to a sparkBOR-JENQ WANG; SAKA, N.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 4, pp 456-466, issn 0148-6411Conference Paper

Compatibility of common MCM-D dielectric with scanning laser ablation via generation processesTESSIER, T. G; CHANDLER, G.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 1, pp 39-45, issn 0148-6411Conference Paper

Effect of an axial magnetic field upon the development of the vacuum arc between opening electric contactsSCHULMAN, M. B; SLADE, P. G; HEBERLEIN, J. V. R et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 2, pp 180-189, issn 0148-6411Conference Paper

Encapsulants used in flip-chip packagesDARBHA SURYANARAYANA; WU, T. Y; VARCOE, J. A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 8, pp 858-862, issn 0148-6411Conference Paper

Fabrication of thin-film multilayer substrate using copper clad polyimide sheetsMIURA, O; MIYAZAKI, K; TAKAHASHI, A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 8, pp 817-821, issn 0148-6411Conference Paper

Multimetal DTAB packages for a 125-MHz computerKAW, R; YANAGA, D; MATTA, F et al.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 1, pp 95-102, issn 0148-6411Conference Paper

Zero-defect sputter deposition metallization method for high volume manufacturing of grafted multilayer thin film modulesSWIRBEL, T.IEEE transactions on components, hybrids, and manufacturing technology. 1993, Vol 16, Num 1, pp 1-5, issn 0148-6411Conference Paper

A feasibility study for the fabrication of planar silicon multichip modules using electron beam lithography for precise location and interconnection of chipsHOPPER, A; JONES, A; AUGUR, R. A et al.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 1, pp 97-102, issn 0148-6411Article

Bonding mechanism between aluminum nitride substrate and Ag-Cu-Ti solderKURIHARA, Y; TAKAHASHI, S; OGIHARA, S et al.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 3, pp 361-368, issn 0148-6411Article

IR microscopic observation of plastic coated TAB inner lead bonds degrading during thermal cyclingALPERN, P; TILGNER, R.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 1, pp 114-117, issn 0148-6411Article

Packaging of GaAs signal processors on multichip modulesGILBERT, B. K; PAN, G. W.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 1, pp 15-28, issn 0148-6411Article

Wear and contamination of electroplated gold films in line contactZHUAN-KE CHEN.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 3, pp 378-385, issn 0148-6411Article

A fracture mechanics approach to thermal fatigue life prediction of solder jointsYI-HSIN PAO.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 4, pp 559-570, issn 0148-6411Article

Are components still the major problem: a review of electronic system and device field failure returnsPECHT, M; RAMAPPAN, V.IEEE transactions on components, hybrids, and manufacturing technology. 1992, Vol 15, Num 6, pp 1160-1164, issn 0148-6411Article